Inline soldering system VADU 300XL
Automated soldering with vacuum
The soldering system VADU 300XL is equipped with three separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production. The system enables void-free solder connections with preforms and /or pastes in a continuous process.
The reproducibility of the soldering processes is guaranteed by permanent process control. The VADU 300XL can also be integrated into customer‘s automation processes.
PINK develops solutions according to customer‘s requirements which range from the optimization of the carrier handling through surrounding transfer systems to connection with pick-and-place machines and robot automation.
System features
Void-free solder connections
Soldering with preforms and / or pastes
Individual soldering profiles
Process temperatures up to 400 °C
Controlled temperature gradients
Short cycle times
Separate soldering and cooling chamber
Flux-free soldering with formic acid
Flux management
Inert gas atmosphere
Residual oxygen content < 5 ppm
Reproducibility of the soldering results
Traceability
Permanent process control
Ethernet interface
Remote maintenance (VPN)
Low energy and media consumption
Internationally patented system
| Type of system | Inline System |
| Number of vacuum chambers | 3 chambers |
| Process area (W x D) | 410 x 280 mm |
| Clearance height | max. 100 mm |
| Vacuum (standard) | ≤ 2 mbar |
| Dimensions of the system (W x D x H) | 2,340 x 1,760 x 1,800 mm |
| Dimensions of pumping unit | 1,000 x 700 x 1,800 mm |
| Weight | 2,000 kg (without pumping unit) |
| Power supply | 3 x 400 V, 50/60 Hz |
| Power input | 25 kVA |
| SMEMA interface | √ |
| Options: | |
| Wafer | Up to 12 “ |
| Induction heating | √ |
| Handling / Transfer systems | √ |
| High vacuum | √ |