Batch soldering system VADU 200XL
Vacuum supported soldering of substrates
The soldering system of type VADU200 XL is equipped with two separate process chambers and can be operated with paste as well as preforms. This allow the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling.
Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.
System features
Void-free solder connections
Soldering with preforms and/or pastes
Individual soldering profiles
Process temperatures up to 400 °C
Controlled temperature gradients
Short cycle times
Separate soldering and cooling chamber
Flux-free soldering with formic acid
Flux management
Inert gas atmosphere
Residual oxygen content < 5 ppm
Reproducibility of the soldering results
Traceability
Permanent process control
Ethernet interface
Remote maintenance (VPN)
Low energy and media consumption
Internationally patented system
| Type of system | Batch System |
| Number of vacuum chambers | 2 chambers |
| Process area (W x D) | 410 x 280 mm |
| Clearance height | max. 100 mm |
| Vacuum (standard) | ≤ 2 mbar |
| Dimensions of the system (W x D x H) | 1,200 x 2,110 x 1,700 mm |
| Dimensions of pumping unit | Integrated |
| Weight | 1,200 kg |
| Power supply | 3 x 400 V, 50/60 Hz |
| Power input | 10 kVA |
| SMEMA interface | – |
| Options: | |
| Wafer | Up to 12″ |
| Induction heating | √ |
| Handling/Transfer systems | √ |
| High vacuum | √ |