Input requirements
Collect sample format, material stack, target output, current issues, and process constraints.
Validate your samples on representative equipment, compare process routes, and optimise recipes before committing to production equipment. AGA supports proof-of-concept, process development, pilot evaluation, and engineering decision-making for advanced packaging and power electronics.
The Demo Lab turns early questions into a practical direction — verify feasibility, identify visible risks, choose the next setup, and define the equipment concept for production.
Collect sample format, material stack, target output, current issues, and process constraints.
Map the likely process route, tooling needs, handling risks, and demo-lab test conditions.
Compare early process windows across pressure, temperature, atmosphere, cycle time, and material response.
Convert observations into equipment concept, scale-up direction, and practical purchase discussion.
A concise direction for equipment selection, parameter starting point, fixture concept, and follow-up validation.
Use real process trials to verify whether the selected equipment, tooling, materials, and parameter windows can meet your manufacturing goals.
Run customer samples, check process compatibility, and confirm whether the proposed equipment route can support your target application.
Shorten internal evaluation cycles by testing key process windows with AGA engineering support and representative demo equipment.
Compare workflows and receive practical recommendations for process setup, system selection, and future scale-up planning.
A typical power electronics or advanced packaging evaluation can combine material deposition, precision bonding, pressure-assisted sintering, and low-void vacuum soldering.
Evaluate material deposition, dot/line consistency, substrate preparation, and process repeatability for early-stage assembly trials.
Review placement accuracy, bonding sequence, handling concept, and module assembly logic for prototypes or pilot production.
Develop pressure-assisted sintering windows for semiconductor attach, substrate-to-baseplate attach, and high-reliability interconnects.
Validate low-void solder joints and thermal performance requirements for demanding power module and electronics applications.
Instead of listing equipment photos, this section explains what the lab can help customers verify during an application evaluation.
Review customer samples and run basic trials to confirm material compatibility, process route, and whether the application is suitable for further development.
Evaluate practical starting windows for deposition, bonding, pressure, temperature, vacuum, atmosphere, and cycle time based on the customer application.
Use trial output to discuss visible quality direction such as void tendency, bond consistency, alignment, wetting behavior, mechanical stability, and repeatability.
Translate trial learning into an equipment concept, automation level, loading method, throughput assumption, and production implementation path.
The demo facility is most valuable when the customer needs technical evidence before equipment purchase, process transfer, or production scale-up.
Die attach, substrate attach, base plate joining, and thermal path validation.
Sintering, soldering, chip topside contacting, and high-power LED package studies.
Evaluate paste, preform, substrate, tooling, and parameter combinations.
Discuss equipment layout, loading concept, throughput assumptions, and future scale-up.
The page now explains the customer journey more clearly, making it easier for visitors to understand what to prepare and what they will receive.
Share sample details, materials, current pain points, and success criteria.
Define process sequence, setup, tooling concept, and evaluation scope.
Run trials with AGA engineers and adjust parameters based on observed results.
Review output quality, practical limitations, and process improvement options.
Receive recommendations for equipment selection, production concept, or further testing.
Validate the process, compare equipment approaches, and build confidence before production investment. Our team helps connect application needs with practical equipment and workflow decisions.