Vacuum Oven

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Soldering with Vacuum VADU 100

The newly developed powerful soldering system VADU 100 is designed for operation with paste, as well as preforms. Based on the compact design and the user friendliness, the system is very suitable for production of small series and in laboratories for research applications

 

  • Void-free solder connections
  • Soldering with preforms or paste
  • Operation with inert or forming gas
  • Formic acid process
  • Flux management
  • Soldering temperatures up to 400c
  • Vacuum supported soldering
  • Individual soldering profiles(e.g.acc.to IPC/JEDEC)
  • Separate soldering and cooling zones
  • Clearly arranged touch screen panel
  • Maintenance friendly process technology

 

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Soldering with Vacuum VADU 200

The VADU 200 soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the VADU 200 system provides the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to this design a very fast heat transfer and an excellent temperature stability can be achieved.

 

  • Soldering with preforms or paste
  • Operation with inert or forming gas
  • Formic acid process
  • Flux management
  • Soldering temperatures up to 400c
  • Vacuum supported soldering
  • Individual soldering profiles(e.g.acc.to IPC/JEDEC)
  • Separate soldering and cooling zones
  • Clearly arranged touch screen panel
  • Maintenance friendly process technology

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Soldering with Vacuum VADU 300

The further improved soldering system VADU 300 is designed for high efficient series production with internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.

 

The new VADU 300: PINK's redesign of the efficient inline soldering results in various improved technical details as well as optimized control and service modules.

 

  • Void-free solder connections
  • Soldering with preforms or paste
  • Operation with inert or forming gas
  • Formic acid process
  • Flux management
  • Soldering temperatures up to 400c
  • Vacuum supported soldering
  • Individual soldering profiles(e.g.acc.to IPC/JEDEC)
  • Separate soldering and cooling zones
  • Clearly arranged touch screen panel
  • Maintenance friendly process technology

 

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X-ray of solder with voids (left) and without voids (right)