Scanning Acoustic Microscope

Machine

The Special Properties of Scanning Acoustic Microscopy

The exceptional property of the acoustics microscopy is, that the inside structure of opaque specimen can be examined, without having to destroy the specimen.

 

The contrast of the images is produced by nonhomogenities in the material. The contrast can be explained by the acoustic impedance, which represents the product of sound velocity multiplicated with tha material density. Thus, special information about material disturbances like microcracks, particles, cavities, voids, and delaminations, but also layers transitions, interfaces or grain structures e.g. can be shown with an imaging resolution comparable to the light microscope.

 

Machine

SAM 300

SAM 300 is a dedicated high throughput,non destructive tool for quality and process control, and research applications. It enables detailed acoustic investigations through new rf and transducer technologies of up to 400 MHz. A graphical user interface ensures that the powerful functionality of SAM 300 is easily applied.

 

Built to industry standards around a core platform that utilises the latest production and research technology, the SAM 300 can accurately handle samples up to 310 mm x 290 mm x 45 mm (w/l/h). It has an ultrasound frequency range up to 500 MHz with transducer from 5 MHz - 400 MHz. Different tank sizes and trays are available.

 

Machine

SAM 300 Twin

SAM 300 TWIN SAM 300 TWIN is a high performance tool enabling non destructive acoustic investigations for high throughput analysis, quality control and research applications. It features a new high speed linear motion scanner and new rf and transducer technologies of up to 400 MHz, controlled through a user friendly graphical interface.

 

A new master/slave concept enables arrays of two transducers to acquire simultanous acoustic images.

 

Built to semiconductor industry standards around a core platform that utilises the latest production and research technology, the SAM TWIN SCAN can accurately handle wafers up to 300 mm. Ultrasound frequency range up to 500 MHz with transducer from 3 MHz - 400 MHz.

 

Scanning range x;y: 200 µmx200µm-320 mm x 320 mm. Auto focus for each transducer

 

Machine

SAM 400 TWIN

 

SAM 400 TWIN is a high performance tool enabling non destructive acoustic investigations for high throughput analysis, quality control and research applications. It features a new high speed linear motion scanner and new rf and transducer technologies of up to 400 MHz, controlled through a user friendly graphical interface.

 

A new master/slave concept enables arrays of two transducers to acquire simultanous acoustic images.

 

Built to semiconductor industry standards around a core platform that utilises the latest production and research technology, the SAM TWIN SCAN can accurately handle wafers up to 400 mm. Ultrasound frequency range up to 500 MHz with transducer from 3 MHz - 400 MHz.

 

Scanning range x;y: 200µm-200µm-430 mm x 430 mm Auto focus for each transducer

 

Machine

SAM 400 QUAD

SAM 400 QUAD is a high performance tool enabling non destructive acoustic investigations for high throughput analysis, quality control and research applications. It features a new high speed linear motion scanner and new rf and transducer technologies of up to 400 MHz, controlled through a user friendly graphical interface.

 

A new master/slave concept enables arrays of four transducers to acquire simultanous acoustic images.

 

Built to semiconductor industry standards around a core platform that utilises the latest production and research technology, the SAM QUAD SCAN can accurately handle wafers up to 400 mm. Ultrasound frequency range up to 500 MHz with transducer from 3 MHz - 400 MHz.

 

Scanning range x;y: 200µm-200µm-430 mm x 430 mm Auto focus for each transducer

 

Machine

SAM 300 Autowafer Single/TWIN/QUAD

SAM 300 Auto Wafer is a product line especially developed for in line production control. It is corresponding to the clean room class down to 10.

 

The main application is related to bonded wafers (MEMS), detection of voids, inclusions or delaminated areas in bonding interfaces.

Machine

Auto Tray

SAM AUTO TRAY line was especially developed for in line production control of electronic devices, boards, IGBT and other complex components. The systems are corresponding to the clean room class down to 10.

 

The main application is related to detection of voids, inclusions or delaminated areas and thickness variation of interfaces in bonding interfaces. Several layers can be inspected simultaneously.